MT6825
3GPP Release-17 IoT-NTN Satellite Communication Solution
MT6825 is a highly integrated, extremely power-efficient, and robust IoT-NTN connectivity solution that can provide global satellite coverage for mobile applications such as messaging, tracking, and emergency services, as well as large-scale satellite IoT applications such as remote monitoring of utilities, infrastructure management, maritime, connected agriculture, fleet management, telematics, and more.
Highly Integrated, Ultra-efficient Platform
The highly integrated MT6825 combines an Arm Cortex-M4F, PSRAM, Flash memory, cellular/satellite transceiver (RF), and a power management unit (PMU) in an extremely compact package, reducing time-to-market, while multiple interfaces allow easy platform integration. MediaTek's sophisticated power-efficiency technologies ensure the chip is particularly suitable for battery-powered devices such as smartphones or other mobile UE.
3GPP Release-17 Standard Connectivity
MT6825 supports 3GPP Release-17 (IoT-NTN) at L-band and S-band frequencies for satellite communications.
NB-IoT supported
NB-IoT cellular networks are also supported, with full frequency band coverage from 450 MHz to 2.1 GHz including 3GPP R13 (NB1) and R14 (NB2) standards. The NB-IoT transceiver contains the 3GPP R13/R14 radio, baseband and MAC that are designed for low power operations and can extend battery life applications for years.
MT6825 has been awarded “Disruptive Device Innovation Award” at the Asia Mobile Awards, held during MWC Shanghai 2023.
Specifications
Processor
CPU
Arm Cortex-M4 with FPU
CPU Core Count
Single (1)
CPU Frequency
156MHz
Memory
32KB + 32Mbit PSRAM
Flash
32Mbit
Connectivity
NTN satellite transceiver
- 3GPP R17 IoT NTN standard
- DL 200 kHz/UL single + multi-tone
- L-band and S-band: B255/B256/B23/B24
Cellular NB-IoT transceiver
- 3GPP R13/R14
- DL 200 kHz/UL single + multi-tone
- L-band and S-band: global bands
- PSM and eDRX mode
Interfaces
Interfaces
SDIO, USB, I2C, UART, SPI, I2S, PWM, GPIO, BPI/MIPI, SIM, AUXADC
Packaging
Package Type
5.6 mm x 5.6 mm x 1.05 mm TFBGA with 0.5 mm pitch