ASIC - TEMP

Why choose MediaTek?

Ideal for companies seeking custom ASIC solutions for differentiation and uniqueness

MediaTek offers a dedicated, industry-leading ASIC service for companies looking to create unique ICs, platforms or products. Now 25 years in business, we have growth to become the world’s 4th largest fabless semiconductor company. We’re capable of building high quality, high-performance ICs at large volumes through our extensive partner ecosystem.

Learn more about MediaTek

  • 25 years in business
  • World's 4th largest fabless semiconductor company
  • Over 2 billion silicon products shipped per year
  • Deep ecosystem with global reach
  • Over 7,000 Patents
  • Over 2 billion products sold annually
  • Extensive expertise in cutting-edge chip design
  • Very broad IP portfolio
  • Demonstrated time-to-market delivery
  • Active involvement and commitment to global technology standards

How it Works

MediaTek’s premium ASIC design service ecosystem

Flexible, yet Comprehensive ASIC Business Model

MediaTek can provide as much ASIC development support as a customer needs; from assistance at the early stages of chip and system design and specification, all the way through to manufacturing and product support.

A Rich IP Portfolio

MediaTek offers a wide range of products and has a deep pool of innovative IPs backing them. It has considerable technical know-how in major categories such as high-performance application processors with heterogeneous computing, Artificial Intelligence, multimedia accelerators, peripheral IO, wireless and wired connectivity.

Advanced Design Methodology

Modern chip design extends beyond the silicon to account for packaging and platform as well. All these factors are important to develop highly reliable products that deliver the optimum of chip, package and PCB parameters, maximizing operational efficiency and value for money.

Leading Backend Design Technology

MediaTek is one of few ASIC design companies capable of creating highly integrated SoC solutions on leading process nodes, enabling us to create products with the best in power, performance and die size to meet the highest demands.

  • 2.5D package solutions (InFO, Interposer, CoWoS)
  • Multi-die package (MCM)
  • Efficient thermal handling in high power designs
  • Reliability for high speed, large chip designs (up to 67.5mm2)

Manufacturing Management

Shipping over a billion products a year means MediaTek has extensive partnerships with all leading suppliers in the SoC manufacturing chain; from foundry partners, to assembly, packaging and testing. If customers have preferred partners, this requirement can be accommodated.