MediaTek Dimensity 7030

Seamless 5G Experiences

Seamless 5G sub-6GHz & mmWave Connectivity

Benefit from a truly seamless 5G experience that fluidly switches between long-reach sub-6GHz and superfast mmWave connections. The Dimensity 7030 can connect to both FR1+FR2 simultaneously, providing up to 53% faster speeds (up to 5.5Gbps) versus competitor platforms that can only connect to 4G LTE and mmWave simultaneously.

Industry-Leading Dual 5G SIM Technologies

The Dimensity 7030 continues MediaTek’s dual SIM industry leadership with support for Dual 5G SA with both embedded and physical SIM, giving users more choice of powerful 5G experiences, and the opportunity for VoNR to provide the best quality voice and video call experience from both SIM connections.

  • Dual 5G SA, Dual VoNR
  • DSDS with FR2 support
  • Global DSDS pSIM+eSIM support
  • Google Wireless Fi dual SIM support

Superior 5G Sub-6GHz

Faster Speeds with 3CC Carrier Aggregation (CA)

In sub-6GHz exclusive domains, the Dimensity 7030 supports the latest 3CC-CA for faster effective speeds of up to 4.6Gbps, greater reach and handover in a coverage area, and includes validated support for 3CC combinations of US cellular operator bands.

Faster Sub-6GHz Uplink Speeds

Support for 2CC-CA uplink in sub-6GHz is ready for US carrier deployment. Using CA uplink improves speeds by up to 67% in urban environments (TDD+FDD) and can double performance in suburban areas (FDD+FDD).

Faster, More Reliable 5G mmWave

Exclusive MediaTek FAR mmWave technology

MediaTek's exclusive Fast, Accurate, Robust (FAR) Beam Technology empowers mmWave (FR2) connections with greater effective performance and connection reliability when moving and where connections are non-line of sight.

  • +47% average throughput gain in non-line of sight with a moving device
  • +21% average throughput gain in non-line of sight from multiple signals
  • +3% average throughput gain in line of sight with a rotating device

MiraVision 760 with Intelligent, Super-fast Displays

The Dimensity 7030 supports Full HD+ displays with super-fast 144Hz refresh rates. High-speed displays provide notably smoother everyday experiences like scrolling and animations in apps. MediaTek Intelligent Display Sync technology improves the power efficiency by dynamically adjusting the refresh rate to only enable faster speeds when it’s needed most.

Native 10-bit color gives vibrant HDR experiences from a billion-color palette. Support for the latest global HDR video content standards includes HDR10+ Adaptive, HLG and Dolby Vision.

Imagiq 760 with Dual HDR Video Capture Engine

The dual HDR video capture engine can record using two cameras simultaneously, giving users unique streaming/videography opportunities to record selfie + environment, or different frames of the same view, such as wide + zoom together, never missing a moment.

Device makers can build smartphones with a main camera up to 108MP, while also making use of the highly capable MediaTek APU 550 to apply class-leading AI-noise reduction techniques for superior low-light photos.

MediaTek APU 550

The multi-core MediaTek APU 550 includes a multi-tasking scheduler that ensures concurrent AI-tasks are efficiently processed with low latency and minimal power consumption. The APU 550 can natively process standard INT8/16 instructions, as well as FP16 in precision-focused tasks.

HyperEngine 5.0 gaming technologies

MediaTek HyperEngine 5.0 makes smarter use of CPU and GPU resources, offers exclusive AI-based Variable Rate Shading (AI-VRS), and MediaTek Intelligent Display Sync to collectively improve power efficiency while gaming. Meanwhile, Wi-Fi and 5G optimizations ensure lower-latency network connections to the game server.

Wi-Fi 6E

Superfast Wi-Fi 6E (2x2 MIMO) is built right into the chip, giving the Dimensity 7030 superior power efficiency compared to competitor platforms use of external Wi-Fi chip solutions. Using new tri-band connectivity (2.4GHz, 5GHz, 6GHz) gives users faster, lower-latency network connections.

Exceptionally Power-efficient Chip

Using the advanced TSMC N6 (6nm-class) production process means the Dimensity 7030 is exceptionally light on power, extending battery life even for the most demanding smartphone users.

Especificaciones

CPU

Processor

  • Arm Cortex-A78 @ 2.5GHz
  • Arm Cortex-A55 @ 2.0GHz

Cores

Octa (8)

CPU Bit

64-bit

Heterogeneous Multi-Processing

Memory and Storage

Memory Type

  • LPDDR5
  • LPDDR4X

Storage Type

  • UFS 3.1
  • UFS 2.1

Connectivity

Cellular Technologies

Sub-6GHz (FR1), mmWave (FR2), 2G-5G Multi-Mode, 5G-CA, 4G-CA, 5G FDD / TDD, 4G FDD / TDD, TD-SCDMA, WDCDMA, EDGE, GSM

Specific Functions

SA & NSA modes; SA Option2, NSA Option3 / 3a / 3x, FR1 TDD+FDD, DSS, FR1 DL 3CC up to 200 MHz, FR1 UL 2CC up to 100MHz, FR2 DL 4CC up to 400MHz + MediaTek FAR mmWave technology, FR1+FR2: 100MHz+400MHz, 256QAM FR1 UL 2CC, 256QAM VoNR / EPS fallback.

GNSS

  • GPS L1CA+L5
  • BeiDou B1I+ B2a
  • Glonass L1OF
  • Galileo E1 + E5a
  • QZSS L1CA+ L5
  • NavIC

Wi-Fi Antenna

2T2R

Wi-Fi

Wi-Fi 6E (a/b/g/n/ac/ax)

Bluetooth Version

5.2

Display

Max Display Resolution

2520 x 1080

Max Refresh Rate

144Hz

AI

AI Accelerator

MediaTek APU 550

Graphics

GPU Type

Arm Mali-G610 MC3

Video Encoding

  • H.265 / HEVC
  • H.264

Video Encoding FPS

4K @ 30FPS

Video Playback

  • H.265 / HEVC
  • H.264
  • MPEG-1/2/4
  • VP-9

Video Playback FPS

4K @ 30FPS

Camera

Max Camera ISP

  • 108MP
  • 20MP + 20MP

Max Video Capture Resolution

3840 x 2160

Camera Features

  • Dual HDR video capture hardware
  • 3X HDR-ISP
  • MFNR
  • 3DNR
  • AINR
  • Hardware Depth Engine
  • Warping Engine