MediaTek Dimensity 8100

The Dimensity 8000 family elevates premium to new dimensions in our incredible new 5G smartphone portfolio. Built using the highly advanced TSMC N5 (5nm-class) production process, it gives users best-in-class power-efficiency – particularly advantageous in high frame rate gaming.

Employing the Dimensity 9000’s groundbreaking technology world-firsts, these chips feature our latest Imagiq 780 photo and video capture engine, our new 5^th generation AI processor, fresh HyperEngine 5.0 gaming enhancements, and a technology-leading Release-16 5G modem; all built into this impressive ultra-efficient chip.

Built using the TSMC N5 (5nm-class) production process, the Dimensity 8100 upgrades gaming with up to 20% more GPU frequency  over the Dimensity 8000, and over 25% better CPU power-efficiency over our previous generation Dimensity chips.

Featuring an octa-core CPU with speeds of up to 2.85GHz, and the latest Arm Mali-G610 MC6 graphics engine, users will experience smooth, high frame rate gaming in top titles while also enjoying up to 20% power savings over competitor alternatives, allowing gamers to play for much longer on battery.

MediaTek HyperEngine 5.0 provides a comprehensive suite of gaming-related optimizations covering 5G and Wi-Fi networking, exclusive AI-VRS and MediaTek Intelligent Display Sync 2.0, plus wireless earbud latency improvements in Bluetooth LE Audio technology with Dual-Link True Wireless Stereo Audio, and much more.

Using the latest Imagiq 780 ISP, photobugs can enjoy AI-NR/HDR in photos, plus the benefits of MediaTek’s latest noise reduction for extreme low-light videography, and AI-based anti-blur techniques, that brings out clearer images and enhanced details.

Dual simultaneous HDR video means users can capture front and rear cameras at the same time: ideal for sharing live experiences with friends, family, or fans, and vlogs.

Users have the most future-proof 5G technologies thanks to an unmatched 3GPP Release-16 5G modem and the latest 5G+5G Dual SIM Dual Standby support. Built directly into the chip, it maximizes power savings in 5G connectivity while also providing up to 4.7Gbps downlink performance.

The APU 580 (MediaTek 5^th Generation AI processor) can work on targeted tasks or together as coprocessor such as AI-ISP, and AI-Video, 2.75X faster than previous generation Dimensity. Featuring a total end-to-end design upgrade that maximizes efficiency at every pipeline step, it unlocks vast new opportunities for device makers to provide fresh experiences, enhanced visuals and upgraded performance.

Device makers can embrace the latest WHQD+ displays with up to 120Hz refresh rates, ensuring their smartphones offer flagship-grade resolutions with a 25% speed upgrade over previous generation Dimensity.

Enabling the latest Wi-Fi 6E standard with tri-band (2.4/5/6GHz), 2x2 antenna and MediaTek’s own hybrid coexistence technologies gives the Dimensity 8100 the lowest latency, excellent speeds and highly reliable connections.

Dimensity 5G Open Resource Architecture allows device makers to create unmatched smartphones that stand out in unique ways across camera, APU, display and connectivity.